DISAI｜Glass Cutting & Laser Marking Integrated Equipment

Industry Upgrade: Break the Traditional SeparateOperation Mode

In conventional deepprocessing of glass, glass cutting and laser marking are performed by two standalone machines. After cutting, glass requires transfer and repositioning, which occupies factory space, risks glass chipping and positioning deviation, lowers production efficiency, and raises equipment procurement and maintenance costs.

The new DISAI integrated glass cutting and laser marking machine integrates the cutting unit and laser marking module into one main machine, sharing a single CNC system and high-precision positioning reference. Both cutting and marking processes can be completed in one clamping setup.

In core configurations, the integrated equipment differs fundamentally from traditional separate units. Conventional separate systems adopt dual systems, dual frames and dual positioning references. By contrast, the integrated model features one main machine, one control system and unified positioning reference. The laser marking module is integrated onto the cutting beam, eliminating crossmachine transfer and repeated calibration.

Compared with split‑type equipment, DISAI integrated machine delivers outstanding advantages:

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For more detailed information about DISAI's integrated glass cutting and laser marking equipment, please click to visit: https://www.disaiglass.com/industry-news/disaiglass-cutting-laser-marking-integrated-equipment/